Opportunities for Economic Co-operation

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Opportunities for Economic Co-operation

University Highlights

On 19 July 2019 a presentation of Taiwan-Slovak co-operation for the local academic and manufacturing sector took place in one of the presentation rooms of the University Science Park TECHNICOM. The event is part of the series called “Taiwan Roundtable” organised directly by the Taipei Representative Office in Bratislava. The speakers at the event were Mr. Larry Tseng (a representative of Taiwan in Slovakia and the Head of the Taipei Representative Office in Bratislava) and Mr. Lin Ching-Nan (the Economic Advisor of the Taipei Representative Office in Bratislava).

The event began with an official reception of guests by Dr.h.c. prof. Ing. Stanislav Kmeť, CSc., the Rector of TUKE, during which the Rector presented TUKE and its activities. Afterwards, a discussion was held on the current economic and cultural co-operation between Taiwan and Slovakia. The previous above-standard academic co-operation between TUKE and the universities in Taiwan, as well as current TUKE Subsidiary Office in Taiwan in the form of an IBC (International Branch Campus), were among the discussed topics.

After that, event participants moved to the USP Technicom for the official opening of the event by the Vice-rector Dr.h.c. prof. Ing. Anton Čižmár, CSc. Mr. Tseng then presented Taiwan and its current economic, political and cultural situation in his approximately 45-minute-long presentation, and highlighted the current areas in which Taiwan has co-operated with Slovakia since 2003.

After the presentation, the official discussion and networking with representatives of the private sector of Eastern Slovakia, including representatives of the Košice Regional Chamber of the Slovak Chamber of Commerce and Industry, Košice IT Valley and others, took place.

The event was evaluated as successful, and several business entities from Eastern Slovakia found common interests with foreign guests, and also with the scientific and research activities of the USP Technicom.

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